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3d Integration In Vlsi Circuits
Implementation Technologies And Applications
idioma: inglês
Editor:
TAYLOR & FRANCIS LTD, junho de 2021 ‧
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85,16€
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SINOPSE
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781032095547 |
| Editor: | TAYLOR & FRANCIS LTD |
| Data de Lançamento: | junho de 2021 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 234 |
| Tipo de produto: | Livro |
| Coleção: | Devices, Circuits, And Systems |
| Classificação Temática: |
Livros em Inglês
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| EAN: | 9781032095547 |
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