adicionar à lista de desejos
3d Integration In Vlsi Circuits
Implementation Technologies And Applications
idioma: inglês
Editor:
TAYLOR & FRANCIS LTD, junho de 2021 ‧
ver detalhes do produto
81,10€
10% DESCONTO
CARTÃO
Y0doblpYZERTbmhKU1VKeFIwaFVSMjByVUdacWVtOHlRMmt4VGswMksxWk9iMVpvYVdSeGFHUk9USEJETWtGaVQwODVSMUZuUTI5TE1HczRWMFo1YTBKU2JqQkhUR2xoTDJwVWFuRjRXVGx4U2xSMGNHbERNVWQxU21kS00yZzBLMFZIVGpKaWFsaFlWR0ZNUzNwNU1uWXllV0pUVVcxYWR6WldSVFJMWkZkM2VFRXliMnhwVDB0ME9VMXVVWE5tVGs1TGFUbHFiazV0VWt0clJrczRiM2xuYlU1a1FqUkpNbU5LTVhVeFJEWlBkbGx1VUVGclZsbGtWekk1SzBvd1pGQXplbWxqTWpOc1RVdENURWRKU1RNMFQzZ3lRelpaVFVjNVEzYzRhRGR5UVM5UFRrOVhWbXRXVW5RelVYZE5SbFE1YTBVell6ZzNTRVp4WjJSdGRsUkJNbTVGYmsxYWJIaHRhM0JsUlVKMWR6azJUREJsWVdGRWRqZFZTMDlqTlRJMU9XOUdlVlowYVZvNE4zcE5LMjh3T1RkVVpXUjBhbmxKUmtWUFoyYzNTRmszWjBGeGVEUnNUVkpFYkVSaVVFNUJaRWh6Y2tzd1lWbGFTR2RxU0Zsd2NGaG9XbXB1VW10MGNrSkhiSFpSWVM5Wk5rWjRlVlJQYlVadmIycDRTazB6V1dadlRuWjFhM2xPTWtZM2RWWTVTMmwxZVhwMVFVaE1TalFyYTJka1ZqRk1TVVp1Tm5OWldUaHBLMU0zTUU1eEwyOWpTelZpU3pKWFJtcFFaSE51UVVwUGJuWkxkR3hJVmxSSGNXWldPVXN5V2xrclR5dFFhRTVWV2taV09WbEliM0ZSTVVsRU1ESlpkRUo1WVd3M1IzRjRRbEIxZFRaWk9YVklaV2gwZGs4eVRrTklMMFpQVEdKSFVHbFBhVzlJVFRWaFJGSm9lR0ZWYkROMVEyRk5hbGRTWm5VMGFVNHJVWE4yYWpGRWIwaEJOMXBxUkRCMGFtcE1kazlJYzNKUVkwdHhZa1o1UlRreVdXTXhjbkV2TTA1VFZHMHhSMVl5VlRWSFQyVXZhMk4wYzA5NFRIVmhjRVZKWkd4SVJreHNTVlZJZFV3M2VXeDBSbk4zVVVGb1lqSTJSazV6YjBKcmIxa3JNVXBaTlRCTU1UaEthbEp3VEhKd2VuTnZXWGMwZUUxSE0xUlBZM0Y1UnpWcVJ6RkNVbWhFT1dORk0zWldkMlZNWjJoSVRXcE9aVlV4Y1V0d2VVaEpSME5uUzNWQmNXbzJSWEY0Y1doMVdtSlNaa0psWkZWSGNUTlRNbWx1SzBKclpHUm1kRFpMVldoWFpFeFNaRE5tU0RNeUwySllORTVDTURRNFIwWmxSVXRNYzNneGNGQmtabmgyTVV3eE5HeFdXRTRyZDBkM1YxTlpiMGRSU2pSdk9EQk1jMnA2Wmk5QlJFaDNMMFV5YW5CNWFBPT06SCt3WVRiK3lhcW43Yk1MWlF0a2piZz09
portes grátis
Venda o seu livro
SINOPSE
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781032095547 |
| Editor: | TAYLOR & FRANCIS LTD |
| Data de Lançamento: | junho de 2021 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 234 |
| Tipo de produto: | Livro |
| Coleção: | Devices, Circuits, And Systems |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Eletricidade e Energia
Livros em Inglês > Outros |
| EAN: | 9781032095547 |
LIVROS DA MESMA COLEÇÃO
-
imagem não disponívelWireless Transceiver CircuitsWireless Transceiver CircuitseBook10%CRC PRESS115,26€ 10% CARTÃO
-
imagem não disponívelMixed-Signal CircuitsMixed-Signal CircuitseBook10%CRC PRESS92,74€ 10% CARTÃO