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3d Integration In Vlsi Circuits
Implementation Technologies And Applications
idioma: inglês
Editor:
TAYLOR & FRANCIS LTD, junho de 2021 ‧
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85,16€
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SINOPSE
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781032095547 |
| Editor: | TAYLOR & FRANCIS LTD |
| Data de Lançamento: | junho de 2021 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 234 |
| Tipo de produto: | Livro |
| Coleção: | Devices, Circuits, And Systems |
| Classificação Temática: |
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| EAN: | 9781032095547 |
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