Through Silicon Vias
Materials, Models, Design, And Performance
language: english
Publisher:
TAYLOR & FRANCIS LTD, June of 2020 ‧
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SYNOPSIS
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
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| Property | Description |
|---|---|
| ISBN: | 9780367574543 |
| Publisher: | TAYLOR & FRANCIS LTD |
| Release Date: | June of 2020 |
| Language: | English |
| Dimensions: | 156 x 234 x 20 mm |
| Cover: | Softcover |
| Pages: | 216 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Others |
| EAN: | 9780367574543 |