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Through Silicon Vias

Materials, Models, Design, And Performance

by Brajesh Kumar Kaushik, Arsalan Alam, Manoj Kumar Majumder e Vobulapuram Ramesh Kumar
language: english
Publisher: TAYLOR & FRANCIS LTD, June of 2020 ‧
70,29€
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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

Through Silicon Vias

Materials, Models, Design, And Performance

by Brajesh Kumar Kaushik, Arsalan Alam, Manoj Kumar Majumder e Vobulapuram Ramesh Kumar

Property Description
ISBN: 9780367574543
Publisher: TAYLOR & FRANCIS LTD
Release Date: June of 2020
Language: English
Dimensions: 156 x 234 x 20 mm
Cover: Softcover
Pages: 216
Format: Book
Categories: Books in English > Engineering > General Engineering
Books in English > Others
EAN: 9780367574543