Through Silicon Vias
Materials, Models, Design, And Performance
language: english
Publisher:
TAYLOR & FRANCIS LTD, June of 2020 ‧
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SYNOPSIS
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9780367574543 |
| Publisher: | TAYLOR & FRANCIS LTD |
| Release Date: | June of 2020 |
| Language: | English |
| Dimensions: | 156 x 234 x 20 mm |
| Cover: | Softcover |
| Pages: | 216 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Others |
| EAN: | 9780367574543 |