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Three-Dimensional Integration Of Semiconductors

Processing, Materials, And Applications

language: english
Publisher: Springer International Publishing AG, March of 2019 ‧
175,73€
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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.

Three-Dimensional Integration Of Semiconductors

Processing, Materials, And Applications

Property Description
ISBN: 9783319792552
Publisher: Springer International Publishing AG
Release Date: March of 2019
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 408
Format: Book
Categories: Books in English > Science > Chemical
Books in English > Medicine > Orthopedics
EAN: 9783319792552