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Testing Of Interposer-Based 2.5d Integrated Circuits
language: english
Publisher:
Springer International Publishing AG, May of 2018 ‧
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SYNOPSIS
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9783319854618 |
| Publisher: | Springer International Publishing AG |
| Release Date: | May of 2018 |
| Language: | English |
| Dimensions: | 156 x 234 x 11 mm |
| Cover: | Softcover |
| Pages: | 182 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
Books in English > Others |
| EAN: | 9783319854618 |