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Solder Paste In Electronics Packaging
Technology And Applications In Surface Mount, Hybrid Circuits, And Component Assembly
Publisher:
SPRINGER, February of 2012 ‧
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60,82€
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SYNOPSIS
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789401160520 |
| Publisher: | SPRINGER |
| Release Date: | February of 2012 |
| Dimensions: | 152 x 229 x 25 mm |
| Cover: | Softcover |
| Pages: | 456 |
| Format: | Book |
| Collection: | Materials Science Series |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9789401160520 |
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