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Solder Paste In Electronics Packaging

Technology And Applications In Surface Mount, Hybrid Circuits, And Component Assembly

by Jennie S. Hwang
Publisher: SPRINGER, February of 2012 ‧
60,82€
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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology.

Solder Paste In Electronics Packaging

Technology And Applications In Surface Mount, Hybrid Circuits, And Component Assembly

by Jennie S. Hwang

Property Description
ISBN: 9789401160520
Publisher: SPRINGER
Release Date: February of 2012
Dimensions: 152 x 229 x 25 mm
Cover: Softcover
Pages: 456
Format: Book
Collection: Materials Science Series
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9789401160520

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