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Proceedings Of Asme 2021 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Interpack2021)
language: english
Publisher:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., May of 2022 ‧
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SYNOPSIS
Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9780791885505 |
| Publisher: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Release Date: | May of 2022 |
| Language: | English |
| Cover: | Softcover |
| Pages: | 648 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Mechanical Engineering
Books in English > Others |
| EAN: | 9780791885505 |
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