Printed Proceedings Of The Interpack 2018 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2018)

by Asme
language: english
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., November of 2019 ‧
198,28€
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A printed collection of 62 full-length, peer-reviewed technical papers. Topics include Heterogeneous Integration: Micro-Systems With Diverse Functionality; Servers of the Future, IoT, and Edge to Cloud; Structural and Physical Health Monitoring; Power Electronics, Energy Conversion, and Storage; and Autonomous, Hybrid, and Electric Vehicles.

Printed Proceedings Of The Interpack 2018 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2018)

by Asme

Property Description
ISBN: 9780791851920
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S.
Release Date: November of 2019
Language: English
Cover: Softcover
Pages: 558
Format: Book
Collection: Pvp
Categories: Books in English > Engineering > Mechanical Engineering
Books in English > Others
EAN: 9780791851920