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Printed Proceedings Of The Interpack 2018 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2018)
Printed Proceedings Of The Interpack 2018 International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Ipack2018)
language: english
Publisher:
AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., November of 2019 ‧
see product details
SYNOPSIS
A printed collection of 62 full-length, peer-reviewed technical papers. Topics include Heterogeneous Integration: Micro-Systems With Diverse Functionality; Servers of the Future, IoT, and Edge to Cloud; Structural and Physical Health Monitoring; Power Electronics, Energy Conversion, and Storage; and Autonomous, Hybrid, and Electric Vehicles.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9780791851920 |
| Publisher: | AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S. |
| Release Date: | November of 2019 |
| Language: | English |
| Cover: | Softcover |
| Pages: | 558 |
| Format: | Book |
| Collection: | Pvp |
| Categories: |
Books in English
>
Engineering
>
Mechanical Engineering
Books in English > Others |
| EAN: | 9780791851920 |
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