10% OFF

Modeling And Simulation For Microelectronic Packaging Assembly

Manufacturing, Reliability And Testing

by Shen (Huazhong University Of Science And Technology, Wuhan, Hubei, China) Liu e Yong Liu
language: english
Publisher: JOHN WILEY & SONS INC, October of 2011 ‧
148,64€
10% OFF CARD
free shipping
Sell ​​your book
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Modeling And Simulation For Microelectronic Packaging Assembly

Manufacturing, Reliability And Testing

by Shen (Huazhong University Of Science And Technology, Wuhan, Hubei, China) Liu e Yong Liu

Property Description
ISBN: 9780470827802
Publisher: JOHN WILEY & SONS INC
Release Date: October of 2011
Language: English
Cover: Hardcover
Pages: 576
Format: Book
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9780470827802