Modeling And Simulation For Microelectronic Packaging Assembly
Manufacturing, Reliability And Testing
language: english
Publisher:
JOHN WILEY & SONS INC, October of 2011 ‧
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SYNOPSIS
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9780470827802 |
| Publisher: | JOHN WILEY & SONS INC |
| Release Date: | October of 2011 |
| Language: | English |
| Cover: | Hardcover |
| Pages: | 576 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Engineering > Electricity and Energy Books in English > Others |
| EAN: | 9780470827802 |