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Materials, Processes, Integration And Reliability In Advanced Interconnects For Micro- And Nanoelectronics: Volume 990

Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.

language: english
Publisher: CAMBRIDGE UNIVERSITY PRESS, June of 2014 ‧
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This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

Materials, Processes, Integration And Reliability In Advanced Interconnects For Micro- And Nanoelectronics: Volume 990

Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.

Property Description
ISBN: 9781107408715
Publisher: CAMBRIDGE UNIVERSITY PRESS
Release Date: June of 2014
Language: English
Dimensions: 152 x 229 x 19 mm
Cover: Softcover
Pages: 358
Format: Book
Collection: Mrs Proceedings
Categories: Books in English > Engineering > Mechanical Engineering
EAN: 9781107408715

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