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Capa do artigo Materials For High-Density Electronic Packaging And Interconnection

Materials For High-Density Electronic Packaging And Interconnection

by National Research Council , Commission On Engineering And Technical Systems , Committee On Materials For High-Density Electronic Packaging, National Materials Advisory Board e Division On Engineering And Physical Sciences

Publisher: NATIONAL ACADEMIES PRESS, January of 1990 ‧ see product details

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Materials For High-Density Electronic Packaging And Interconnection

by National Research Council , Commission On Engineering And Technical Systems , Committee On Materials For High-Density Electronic Packaging, National Materials Advisory Board e Division On Engineering And Physical Sciences
Property	Description
ISBN:	9780309042338
Publisher:	NATIONAL ACADEMIES PRESS
Release Date:	January of 1990
Dimensions:	216 x 280 x 20 mm
Cover:	Softcover
Pages:	156
Format:	Book
Categories:	Books in English > Engineering > Mechanical Engineering
EAN:	9780309042338

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