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Istfa 2021

Conference Proceedings From The 47th International Symposium For Testing And Failure Analysis

by Asm International
language: english
Publisher: A S M International, July of 2022 ‧
233,87€
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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.

Istfa 2021

Conference Proceedings From The 47th International Symposium For Testing And Failure Analysis

by Asm International

Property Description
ISBN: 9781627084192
Publisher: A S M International
Release Date: July of 2022
Language: English
Cover: Softcover
Pages: 461
Format: Book
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Mechanical Engineering
Books in English > Others
EAN: 9781627084192