adicionar à lista de desejos
3d Tcad Simulation For Cmos Nanoeletronic Devices
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, July of 2017 ‧
see product details
148,70€
10% OFF
CARD
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
free shipping
Sell your book
SYNOPSIS
This book demonstrates how to use the Synopsys Sentaurus TCAD 2014 version for the design and simulation of 3D CMOS (complementary metalâ€"oxideâ€"semiconductor) semiconductor nanoelectronic devices, while also providing selected source codes (Technology Computer-Aided Design, TCAD).
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789811030659 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | July of 2017 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 330 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
|
| EAN: | 9789811030659 |