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3d Stacked Chips

From Emerging Processes To Heterogeneous Systems

language: english
Publisher: Springer International Publishing AG, May of 2018 ‧
60,82€
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

3d Stacked Chips

From Emerging Processes To Heterogeneous Systems

Property Description
ISBN: 9783319793054
Publisher: Springer International Publishing AG
Release Date: May of 2018
Language: English
Dimensions: 156 x 234 x 19 mm
Cover: Softcover
Pages: 339
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9783319793054