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3d Stacked Chips
From Emerging Processes To Heterogeneous Systems
language: english
Publisher:
Springer International Publishing AG, May of 2018 ‧
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SYNOPSIS
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9783319793054 |
| Publisher: | Springer International Publishing AG |
| Release Date: | May of 2018 |
| Language: | English |
| Dimensions: | 156 x 234 x 19 mm |
| Cover: | Softcover |
| Pages: | 339 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9783319793054 |