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3d Microelectronic Packaging

From Architectures To Applications

language: english
Publisher: SPRINGER VERLAG, SINGAPORE, November of 2021 ‧
216,29€
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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

3d Microelectronic Packaging

From Architectures To Applications

Property Description
ISBN: 9789811570926
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: November of 2021
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 622
Format: Book
Collection: Springer Series In Advanced Microelectronics
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Mechanical Engineering
Books in English > Others
EAN: 9789811570926

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