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3d Microelectronic Packaging
From Architectures To Applications
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, November of 2021 ‧
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216,29€
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SYNOPSIS
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789811570926 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | November of 2021 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Softcover |
| Pages: | 622 |
| Format: | Book |
| Collection: | Springer Series In Advanced Microelectronics |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Engineering > Mechanical Engineering Books in English > Others |
| EAN: | 9789811570926 |
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