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3d Microelectronic Packaging
From Architectures To Applications
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, November of 2020 ‧
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216,29€
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SYNOPSIS
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789811570896 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | November of 2020 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 622 |
| Format: | Book |
| Collection: | Springer Series In Advanced Microelectronics |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Engineering > Mechanical Engineering |
| EAN: | 9789811570896 |
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