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3d Microelectronic Packaging
From Architectures To Applications
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, November of 2020 ‧
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216,29€
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SYNOPSIS
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
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| Property | Description |
|---|---|
| ISBN: | 9789811570896 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | November of 2020 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 622 |
| Format: | Book |
| Collection: | Springer Series In Advanced Microelectronics |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Engineering > Mechanical Engineering |
| EAN: | 9789811570896 |
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