10% OFF

3d Microelectronic Packaging

From Architectures To Applications

language: english
Publisher: SPRINGER VERLAG, SINGAPORE, November of 2020 ‧
216,29€
10% OFF CARD
free shipping
Sell ​​your book
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

3d Microelectronic Packaging

From Architectures To Applications

Property Description
ISBN: 9789811570896
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: November of 2020
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 622
Format: Book
Collection: Springer Series In Advanced Microelectronics
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Mechanical Engineering
EAN: 9789811570896

BOOKS FROM THE SAME COLLECTION