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3d Microelectronic Packaging
From Fundamentals To Applications
language: english
Publisher:
Springer International Publishing AG, July of 2018 ‧
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SYNOPSIS
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9783319830865 |
| Publisher: | Springer International Publishing AG |
| Release Date: | July of 2018 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Softcover |
| Pages: | 463 |
| Format: | Book |
| Collection: | Springer Series In Advanced Microelectronics |
| Categories: |
Books in English
>
Engineering
>
General Engineering
Books in English > Engineering > Mechanical Engineering |
| EAN: | 9783319830865 |
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