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3d Microelectronic Packaging

From Fundamentals To Applications

language: english
Publisher: Springer International Publishing AG, July of 2018 ‧
216,29€
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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

3d Microelectronic Packaging

From Fundamentals To Applications

Property Description
ISBN: 9783319830865
Publisher: Springer International Publishing AG
Release Date: July of 2018
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 463
Format: Book
Collection: Springer Series In Advanced Microelectronics
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Mechanical Engineering
EAN: 9783319830865

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