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3d Integration In Vlsi Circuits
Implementation Technologies And Applications
language: english
Publisher:
TAYLOR & FRANCIS LTD, June of 2021 ‧
see product details
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SYNOPSIS
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781032095547 |
| Publisher: | TAYLOR & FRANCIS LTD |
| Release Date: | June of 2021 |
| Language: | English |
| Dimensions: | 156 x 234 x 20 mm |
| Cover: | Softcover |
| Pages: | 234 |
| Format: | Book |
| Collection: | Devices, Circuits, And Systems |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
Books in English > Others |
| EAN: | 9781032095547 |
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