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3d Integration In Vlsi Circuits

Implementation Technologies And Applications

language: english
Publisher: TAYLOR & FRANCIS LTD, June of 2021 ‧
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The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

3d Integration In Vlsi Circuits

Implementation Technologies And Applications

Property Description
ISBN: 9781032095547
Publisher: TAYLOR & FRANCIS LTD
Release Date: June of 2021
Language: English
Dimensions: 156 x 234 x 20 mm
Cover: Softcover
Pages: 234
Format: Book
Collection: Devices, Circuits, And Systems
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9781032095547