Capa do artigo Modeling And Simulation For Microelectronic Packaging Assembly
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Modeling And Simulation For Microelectronic Packaging Assembly eBook

Manufacturing, Reliability And Testing

by Shen Liu e Yong Liu
language: english
Publisher: WILEY, August of 2011 ‧
140,38€
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An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Modeling And Simulation For Microelectronic Packaging Assembly

Manufacturing, Reliability And Testing

by Shen Liu e Yong Liu

Property Description
ISBN: 9780470828410
Publisher: WILEY
Release Date: August of 2011
Language: English
Format: eBook
File Format and Compatibility:
Categories: eBooks in English > Engineering > General Engineering
EAN: 9780470828410
Acessibilidade: Ver características de acessibilidade indicadas pelo editor

YONG LIU

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