Capa do artigo Modeling And Application Of Flexible Electronics Packaging
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Modeling And Application Of Flexible Electronics Packaging eBook

by Yongan Huang, Xiaodong Wan e Zhouping Yin
language: english
Publisher: Springer Nature Singapore, April of 2019 ‧
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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.

Modeling And Application Of Flexible Electronics Packaging

by Yongan Huang, Xiaodong Wan e Zhouping Yin

Property Description
ISBN: 9789811336270
Publisher: Springer Nature Singapore
Release Date: April of 2019
Language: English
Format: eBook
File Format and Compatibility:
Collection: Engineering
Categories: eBooks in English > Engineering > Hydraulic Engineering
EAN: 9789811336270
Acessibilidade: Ver características de acessibilidade indicadas pelo editor

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