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Microwave And Millimeter-Wave Electronic Packaging eBook
language: english
Publisher:
ARTECH HOUSE, January of 2013 ‧
see product details
99,38€
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IMMEDIATE AVAILABILITY
Ebook for ADE
SYNOPSIS
Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781608076987 |
| Publisher: | ARTECH HOUSE |
| Release Date: | January of 2013 |
| Language: | English |
| Pages: | 280 |
| Format: | eBook |
| File Format and Compatibility: | PDF para ADE |
| Categories: |
eBooks in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9781608076987 |
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