Capa do artigo Advanced Materials For Thermal Management Of Electronic Packaging
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Advanced Materials For Thermal Management Of Electronic Packaging eBook

by Xingcun Colin Tong
language: english
Publisher: SPRINGER NEW YORK, January of 2011 ‧
290,84€
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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance.

Advanced Materials For Thermal Management Of Electronic Packaging

by Xingcun Colin Tong

Property Description
ISBN: 9781441977595
Publisher: SPRINGER NEW YORK
Release Date: January of 2011
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Springer Series In Advanced Microelectronics
Categories: eBooks in English > Engineering > Hydraulic Engineering
EAN: 9781441977595

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