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3d Microelectronic Packaging eBook

From Architectures To Applications

language: english
Publisher: Springer Nature Singapore, November of 2020 ‧
211,34€
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Ebook for ADE
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

3d Microelectronic Packaging

From Architectures To Applications

Property Description
ISBN: 9789811570902
Publisher: Springer Nature Singapore
Release Date: November of 2020
Language: English
Format: eBook
File Format and Compatibility:
Collection: Springer Series In Advanced Microelectronics
Categories: eBooks in English > Engineering > Electricity and Energy
eBooks in English > Engineering > Hydraulic Engineering
EAN: 9789811570902
Acessibilidade: Ver características de acessibilidade indicadas pelo editor

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