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Thermomechanical Simulation Methodologies For Advanced Semiconductor Packaging eBook
idioma: inglês
Editor:
The Institution of Engineering and Technology, junho de 2025 ‧
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172,92€
10% DESCONTO
IMEDIATO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781837245444 |
| Editor: | The Institution of Engineering and Technology |
| Data de Lançamento: | junho de 2025 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | |
| Classificação Temática: |
eBooks em Inglês
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Eletricidade e Energia
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| EAN: | 9781837245444 |
| Acessibilidade: | Ver características de acessibilidade indicadas pelo editor |