Capa do artigo Tsv 3d Rf Integration

Tsv 3d Rf Integration

High Resistivity Si Interposer Technology

by Yufeng (Professor, Peking University, China) Jin
Book eBook
language: english
Publisher: Elsevier - Health Sciences Division, April of 2022 ‧
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Tsv 3d Rf Integration

High Resistivity Si Interposer Technology

by Yufeng (Professor, Peking University, China) Jin

Property Description
ISBN: 9780323996020
Publisher: Elsevier - Health Sciences Division
Release Date: April of 2022
Language: English
Dimensions: 191 x 235 x 20 mm
Cover: Softcover
Pages: 292
Format: Book
Categories: Books in English > Engineering > Mechanical Engineering
Books in English > Others
EAN: 9780323996020