Capa do artigo Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture

Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture

Effects Of Temperature, Moisture, Mechanical And Electrical Driving Forces

by E-H Wong
language: english
Publisher: ELSEVIER SCIENCE & TECHNOLOGY, May of 2015 ‧
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Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.

Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture

Effects Of Temperature, Moisture, Mechanical And Electrical Driving Forces

by E-H Wong

Property Description
ISBN: 9781845695286
Publisher: ELSEVIER SCIENCE & TECHNOLOGY
Release Date: May of 2015
Language: English
Dimensions: 152 x 229 x 20 mm
Cover: Hardcover
Pages: 482
Format: Book
Collection: Woodhead Publishing Series In Electronic And Optical Materials
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9781845695286

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