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Encapsulation Technologies For Electronic Applications
language: english
Publisher:
WILLIAM ANDREW PUBLISHING, July of 2009 ‧
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SYNOPSIS
Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants.
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| Property | Description |
|---|---|
| ISBN: | 9780815515760 |
| Publisher: | WILLIAM ANDREW PUBLISHING |
| Release Date: | July of 2009 |
| Language: | English |
| Cover: | Hardcover |
| Pages: | 504 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
|
| EAN: | 9780815515760 |
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