Asme 2020 Proceedings Of The International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Interpack2020)

by American Society Of Mechanical Engineers
language: english
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S., July of 2024 ‧
OUT OF STOCK OR NOT AVAILABLE
Sell ​​your book
Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

Asme 2020 Proceedings Of The International Technical Conference And Exhibition On Packaging And Integration Of Electronic And Photonic Microsystems (Interpack2020)

by American Society Of Mechanical Engineers

Property Description
ISBN: 9780791884041
Publisher: AMERICAN SOCIETY OF MECHANICAL ENGINEERS,U.S.
Release Date: July of 2024
Language: English
Dimensions: 213 x 276 x 20 mm
Cover: Softcover
Pages: 566
Format: Book
Collection: Asme Press Book Series On Electronic Packaging
Categories: Books in English > Engineering > Mechanical Engineering
Books in English > Others
EAN: 9780791884041

BOOKS FROM THE SAME COLLECTION