Area Array Packaging Processes

by Ken Gilleo
language: english
Publisher: MCGRAW-HILL EDUCATION - EUROPE, October of 2003 ‧
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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Area Array Packaging Processes

by Ken Gilleo

Property Description
ISBN: 9780071738019
Publisher: MCGRAW-HILL EDUCATION - EUROPE
Release Date: October of 2003
Language: English
Cover: Softcover
Pages: 272
Format: Book
Collection: Lands, Peoples & Cultures S.
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9780071738019